Jigsaw Puzzle : Solder bumps, SEM
Jigsaw Puzzles From Science Photo Library
Solder bumps, SEM
Solder bumps. Scanning electron micrograph (SEM) of rows of solder bumps on a substrate. Solder is a metal alloy that is melted to join metallic surfaces. The process is known as soldering. The type of alloy used depends on the metals that are to be joined. Alloys with low melting temperatures are known as soft solders, those with high melting temperatures are known as hard solders
Science Photo Library features Science and Medical images including photos and illustrations
Media ID 6430219
© COLIN CUTHBERT/SCIENCE PHOTO LIBRARY
Alloy Binding Bond Bonding Bump Bumps Electronics Join Joined Joining Line Lines Material Materials Science Melted Metal Metallic Microelectronics Rows Solder Soldering Substrate Binder Solders
Jigsaw Puzzle (520 Pieces)
Discover the intricacies of microelectronics with our Media Storehouse Jigsaw Puzzle featuring the captivating image "Solder bumps, SEM" by Science Photo Library. This challenging puzzle showcases a Scanning Electron Micrograph (SEM) image of meticulously aligned solder bumps on a substrate. Delve into the world of soldering, a crucial process in electronics manufacturing, where solder is melted to join metallic surfaces. Assemble this fascinating puzzle to enhance your knowledge and appreciation for the complexities of modern technology.
Made in the USA, 520-piece puzzles measure 16" x 20" (40.6 x 50.8 cm). Every puzzle is meticulously printed on glossy photo paper, which has a strong 1.33 mm thickness. Delivered in a black storage cardboard box, these puzzles are both stylish and practical. (Note: puzzles contain small parts and are not suitable for children under 3 years of age.)
Jigsaw Puzzles are an ideal gift for any occasion
Estimated Product Size is 50.8cm x 40.5cm (20" x 15.9")
These are individually made so all sizes are approximate
Artwork printed orientated as per the preview above, with landscape (horizontal) or portrait (vertical) orientation to match the source image.
EDITORS COMMENTS
This print captures the intricate beauty of solder bumps, as seen under a scanning electron microscope (SEM). Rows upon rows of these tiny metallic bumps adorn a substrate, showcasing the remarkable technology behind joining metallic surfaces. Soldering, the process by which these bumps are formed, involves melting a metal alloy known as solder to create strong bonds between materials. The choice of alloy used in soldering depends on the specific metals being joined. Soft solders with low melting temperatures and hard solders with high melting temperatures are both employed depending on the desired outcome. This technological marvel plays a crucial role in various industries such as microelectronics and materials science. The image showcases not only the precision and skill required in bonding technology but also highlights the importance of this technique in creating reliable connections within electronic devices. Each line and bump represents an essential binding agent that ensures optimal performance. Science Photo Library has once again captured an extraordinary moment where art meets science. This photograph serves as a reminder of how even seemingly mundane aspects of our technological world can hold immense beauty when viewed through the lens of scientific exploration.
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