Canvas Print : Solder bumps, SEM
Canvas Prints From Science Photo Library
Solder bumps, SEM
Solder bumps. Scanning electron micrograph (SEM) of rows of solder bumps on a substrate. Solder is a metal alloy that is melted to join metallic surfaces. The process is known as soldering. The type of alloy used depends on the metals that are to be joined. Alloys with low melting temperatures are known as soft solders, those with high melting temperatures are known as hard solders
Science Photo Library features Science and Medical images including photos and illustrations
Media ID 6430219
© COLIN CUTHBERT/SCIENCE PHOTO LIBRARY
Alloy Binding Bond Bonding Bump Bumps Electronics Join Joined Joining Line Lines Material Materials Science Melted Metal Metallic Microelectronics Rows Solder Soldering Substrate Binder Solders
20"x16" (51x41cm) Canvas Print
Discover the intricacies of technology with our Media Storehouse Canvas Prints featuring the captivating image "Solder Bumps, SEM" by Science Photo Library. This mesmerizing Scanning Electron Micrograph (SEM) showcases the meticulous arrangement of solder bumps on a substrate. Soldering, a process of joining metallic surfaces, is brought to life in stunning detail. Our high-quality canvas prints are perfect for adding a touch of scientific wonder to any space. Experience the beauty of science up close and personal.
Delivered stretched and ready to hang our premium quality canvas prints are made from a polyester/cotton blend canvas and stretched over a 1.25" (32mm) kiln dried knot free wood stretcher bar. Packaged in a plastic bag and secured to a cardboard insert for safe transit.
Canvas Prints add colour, depth and texture to any space. Professionally Stretched Canvas over a hidden Wooden Box Frame and Ready to Hang
Estimated Product Size is 50.8cm x 40.6cm (20" x 16")
These are individually made so all sizes are approximate
Artwork printed orientated as per the preview above, with landscape (horizontal) orientation to match the source image.
EDITORS COMMENTS
This print captures the intricate beauty of solder bumps, as seen under a scanning electron microscope (SEM). Rows upon rows of these tiny metallic bumps adorn a substrate, showcasing the remarkable technology behind joining metallic surfaces. Soldering, the process by which these bumps are formed, involves melting a metal alloy known as solder to create strong bonds between materials. The choice of alloy used in soldering depends on the specific metals being joined. Soft solders with low melting temperatures and hard solders with high melting temperatures are both employed depending on the desired outcome. This technological marvel plays a crucial role in various industries such as microelectronics and materials science. The image showcases not only the precision and skill required in bonding technology but also highlights the importance of this technique in creating reliable connections within electronic devices. Each line and bump represents an essential binding agent that ensures optimal performance. Science Photo Library has once again captured an extraordinary moment where art meets science. This photograph serves as a reminder of how even seemingly mundane aspects of our technological world can hold immense beauty when viewed through the lens of scientific exploration.
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